XMC is publicly identified to be planning a large HBM capacity buildout, and it's difficult to see how this RFF would forestall XMC, or any other firm added to the brand new RFF category, from deceptively acquiring a big amount of advanced equipment, ostensibly for the manufacturing of legacy chips, after which repurposing that equipment at a later date for HBM manufacturing. Multiple industry sources informed CSIS that Chinese companies are making larger progress in etching and deposition equipment, the first basis of TSV technology, than they are in lithography. Today, YMTC is reportedly one of the key members of the Huawei-led semiconductor network, with XMC being Huawei’s primary accomplice for HBM manufacturing. One would possibly assume that studying all of those controls would supply a clear image of how the United States intends to use and implement export controls. In short, CXMT is embarking upon an explosive memory product capability growth, one that may see its global market share improve more than ten-fold in contrast with its 1 percent DRAM market share in 2023. That huge capability expansion translates directly into huge purchases of SME, and one which the SME industry discovered too attractive to turn down.

When reading this paper I had the distinct feeling that it'd soon be ‘overtaken by reality’, like so many thoughtful papers revealed concerning the supposed gulf between today’s AI programs and actually good ones. Like their predecessor updates, these controls are extremely sophisticated. The costs are currently high, but organizations like DeepSeek are slicing them down by the day.