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2025.02.04 00:07

Is AI Hitting A Wall?

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HTML-Icon-Final.png On Jan. 20, 2025, DeepSeek released its R1 LLM at a fraction of the price that different distributors incurred in their own developments. Released in January, DeepSeek claims R1 performs as well as OpenAI’s o1 model on key benchmarks. Likewise, the company recruits individuals with none computer science background to assist its technology understand different subjects and knowledge areas, including being able to generate poetry and carry out properly on the notoriously tough Chinese college admissions exams (Gaokao). Being a reasoning mannequin, R1 successfully reality-checks itself, which helps it to avoid a few of the pitfalls that normally journey up fashions. DeepSeek LM fashions use the identical architecture as LLaMA, an auto-regressive transformer decoder model. The training was primarily the identical as DeepSeek-LLM 7B, and was educated on a part of its coaching dataset. Measuring mathematical drawback solving with the math dataset. RACE: giant-scale reading comprehension dataset from examinations. Chiang, E. Frick, L. Dunlap, T. Wu, B. Zhu, J. E. Gonzalez, and that i. Stoica.


fmicb-14-1141227-g003.jpg Thakkar et al. (2023) V. Thakkar, P. Ramani, C. Cecka, A. Shivam, H. Lu, E. Yan, J. Kosaian, M. Hoemmen, H. Wu, A. Kerr, M. Nicely, D. Merrill, D. Blasig, F. Qiao, P. Majcher, P. Springer, M. Hohnerbach, J. Wang, and M. Gupta. Touvron et al. (2023b) H. Touvron, L. Martin, K. Stone, P. Albert, A. Almahairi, Y. Babaei, N. Bashlykov, S. Batra, P. Bhargava, S. Bhosale, D. Bikel, L. Blecher, C. Canton-Ferrer, M. Chen, G. Cucurull, D. Esiobu, J. Fernandes, J. Fu, W. Fu, B. Fuller, C. Gao, V. Goswami, N. Goyal, A. Hartshorn, S. Hosseini, R. Hou, H. Inan, M. Kardas, V. Kerkez, M. Khabsa, I. Kloumann, A. Korenev, P. S. Koura, M. Lachaux, T. Lavril, J. Lee, D. Liskovich, Y. Lu, Y. Mao, X. Martinet, T. Mihaylov, P. Mishra, I. Molybog, Y. Nie, A. Poulton, J. Reizenstein, R. Rungta, K. Saladi, A. Schelten, R. Silva, E. M. Smith, R. Subramanian, X. E. Tan, B. Tang, R. Taylor, A. Williams, J. X. Kuan, P. Xu, Z. Yan, I. Zarov, Y. Zhang, A. Fan, M. Kambadur, S. Narang, A. Rodriguez, R. Stojnic, S. Edunov, and T. Scialom. Wang et al. (2024b) Y. Wang, X. Ma, G. Zhang, Y. Ni, A. Chandra, S. Guo, W. Ren, A. Arulraj, X. He, Z. Jiang, T. Li, M. Ku, K. Wang, A. Zhuang, R. Fan, X. Yue, and W. Chen.


Guo et al. (2024) D. Guo, Q. Zhu, D. Yang, Z. Xie, K. Dong, W. Zhang, G. Chen, X. Bi, Y. Wu, Y. K. Li, F. Luo, Y. Xiong, and W. Liang. Huang et al. (2023) Y. Huang, Y. Bai, Z. Zhu, J. Zhang, J. Zhang, T. Su, J. Liu, C. Lv, Y. Zhang, J. Lei, et al. Shao et al. (2024) Z. Shao, P. Wang, Q. Zhu, R. Xu, J. Song, M. Zhang, Y. Li, Y. Wu, and D. Guo. Li et al. (2023) H. Li, Y. Zhang, F. Koto, Y. Yang, H. Zhao, Y. Gong, N. Duan, and T. Baldwin. Luo et al. (2024) Y. Luo, Z. Zhang, R. Wu, H. Liu, Y. Jin, K. Zheng, M. Wang, Z. He, G. Hu, L. Chen, et al. Gao et al. (2020) L. Gao, S. Biderman, S. Black, L. Golding, T. Hoppe, C. Foster, J. Phang, H. He, A. Thite, N. Nabeshima, et al. Wang et al. (2024a) L. Wang, H. Gao, C. Zhao, X. Sun, and D. Dai. Gu et al. (2024) A. Gu, B. Rozière, H. Leather, A. Solar-Lezama, G. Synnaeve, and S. I. Wang.


Krishna et al. (2024) S. Krishna, K. Krishna, A. Mohananey, S. Schwarcz, A. Stambler, S. Upadhyay, and M. Faruqui. Fishman et al. (2024) M. Fishman, B. Chmiel, R. Banner, and D. Soudry. Lin (2024) B. Y. Lin. Qi et al. (2023b) P. Qi, X. Wan, G. Huang, and M. Lin. Qi et al. (2023a) P. Qi, X. Wan, G. Huang, and M. Lin. Kalamkar et al. (2019) D. Kalamkar, D. Mudigere, N. Mellempudi, D. Das, K. Banerjee, S. Avancha, D. T. Vooturi, N. Jammalamadaka, J. Huang, H. Yuen, et al. Sakaguchi et al. (2019) K. Sakaguchi, R. L. Bras, C. Bhagavatula, and Y. Choi. Kwiatkowski et al. (2019) T. Kwiatkowski, J. Palomaki, O. Redfield, M. Collins, A. P. Parikh, C. Alberti, D. Epstein, I. Polosukhin, J. Devlin, K. Lee, K. Toutanova, L. Jones, M. Kelcey, M. Chang, A. M. Dai, J. Uszkoreit, Q. Le, and S. Petrov. Suzgun et al. (2022) M. Suzgun, N. Scales, N. Schärli, S. Gehrmann, Y. Tay, H. W. Chung, A. Chowdhery, Q. V. Le, E. H. Chi, D. Zhou, et al. It additionally has abundant computing power for AI, since High-Flyer had by 2022 amassed a cluster of 10,000 of California-based mostly Nvidia’s high-performance A100 graphics processor chips which might be used to construct and run AI systems, according to a post that summer on Chinese social media platform WeChat.



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